EEJA (TANAKA Precious Metals) to Exhibit at 37th INTERNEPCON JAPAN JCN Newswire

EEJA (TANAKA Precious Metals) to Exhibit at 37th INTERNEPCON JAPAN

TOKYO, Jan 25, 2023 - (JCN Newswire via SEAPRWire.com) - EEJA Ltd. (Head Office: Hiratsuka-shi, Kanagawa; Representative Director & Group CEO: Toru Shoji; hereafter "EEJA"), which operates TANAKA Precious Metals' plating business, announced today that it would exhibit at the 37th INTERNEPCON JAPAN, the electronics packaging and manufacturing exhibition to be held at Tokyo Big Sight on January 25-27, 2023. Exhibiting at INTERNEPCON JAPAN for the first time in four years, EEJA will premiere four new products related to plating technologies and processes. Together, they will help meet rising needs in the electronics industry, such as expanded data bandwidth in communications environments and improved durability of in-vehicle electronic components and semiconductors.SEADCAT200 seriesThis will be EEJA's first exhibition at INTERNEPCON JAPAN since 2019, and the technologies in demand have become increasingly sophisticated in recent years. The main usage domain for electronic components has shifted from local to network usage, while the communications industry has shifted to 5G (5th generation mobile communication systems) to support increased data volumes and faster speeds. The automotive industry has also changed, with the increased use of electronic components and semiconductors around the engine and subsequent demand for products able to pass testing in harsh environments in terms of characteristics such as heat and moisture resistance.Taking advantage of precious metals technologies acquired by TANAKA Precious Metals over many years in the industry, EEJA develops and provides the plating technologies and products that are essential in the electronics industry, from semiconductors to electronic components. To meet the diverse and ever-changing needs of customers, the company is constantly researching and developing new plating characteristics and high-productivity processes tailored to each application. EEJA will exhibit four new plating technologies at INTERNEPCON JAPAN, together with plating equipment capable of handling increasingly high-density wafers. With the increasing demand for greater sophistication in the electronics industry, these new offerings not only meet diverse needs but will contribute to further technical innovations as well.Overview of EEJA's exhibition at 37th INTERNEPCON JAPAN- Date and time: January 25-27, 2023 (10:00-17:00)- Venue: Tokyo Big Sight, East Hall, Booth 26-1- Main products on display:Product: PRECIOUSFAB Pt2000/HP3000- High hardness, high corrosion resistance platinum and platinum alloy plating process (New Product)Overview: A plating process that achieves high reliability when used for surface treatment of contact parts of connectors that need durability and environment resistance, such as for in-vehicle applicationsProduct: AC FAB Au-IAG1000- Direct palladium non-cyanide electroless gold plating process (New Product)Overview: A plating process that enables process simplification and high-quality film formation that controls corrosion when applied to nickel, palladium, and gold plating processes used in surface treatment of semiconductor package partsProduct: MICROFAB Au2108/Au2168- Non-cyanide gold electroplating process with improved stability of hardness and appearance (New Product)Overview: A plating process that can improve product yields and reliability through stable appearance and hardness when forming gold bumps on increasingly fine-pitch and high-density wafersProduct: SEADCAT200 series- Direct patterning plating technology (New Product)Overview: A plating technology that supports more material types than the SEADCAT100 series- SEADCAT PRM200-MRG: Increased adhesiveness to LCPs and some fluororesins, with improved heat and moisture resistance- SEADCAT PRM200-MDI: Reduced copper diffusion through heat treatment after copper wire formation on polyimidesProduct: RAD-Plater- Plating system for development and experimentation (Plating Equipment)Overview: A system that improves in-plane distribution when pattern plating on high-density wafers, with support for a wide range of wafers, from memory redistribution to MEMSPlease refer to the following for detailed information on other plating processes and equipment:Plating Processeshttps://tanaka-preciousmetals.com/en/products/detail/plating-processes/Plating Equipmenthttps://tanaka-preciousmetals.com/en/products/detail/plating-equipment/Plating equipment handled by group company Mitomo Semicon Engineering Co., Ltd.https://mitomo-semicon-eng.co.jp/en/home-2/EEJA Ltd.Headquarters: 5-50 Shinmachi, Hiratsuka-city, KanagawaEstablished: 1965Representative Director & Group CEO: Toru ShojiCapital: 100 million yenNet sales: 38.092 billion yen (FY2022)Number of employees: 127 (including overseas sites) (as of March 31, 2022)Business activities: Development, manufacture, sales, and export of precious metal plating solutions and base metal plating solutions, additives, and surface treatment-related chemicalsAbout TANAKA Precious MetalsSince its foundation in 1885, TANAKA Precious Metals has built a portfolio of products to support a diversified range of business uses focused on precious metals. TANAKA is a leader in Japan regarding the volumes of precious metals handled. Over the course of many years, TANAKA has not only manufactured and sold precious metal products for industry but also provided precious metals in such forms as jewelry and assets. As precious metals specialists, all Group companies in Japan and around the world collaborate and cooperate on manufacturing, sales, and technology development to offer a full range of products and services. With 5,225 employees, the Group's consolidated net sales for the fiscal year ending March 31, 2022, were 787.7 billion yen.Global industrial business website: https://tanaka-preciousmetals.com/en/Product inquiries: TANAKA Kikinzoku Kogyo K.K.https://tanaka-preciousmetals.com/en/inquiries-on-industrial-products/Press inquiries: TANAKA Holdings Co., Ltd.https://tanaka-preciousmetals.com/en/inquiries-for-media/ Copyright 2023 JCN Newswire. All rights reserved. (via SEAPRWire)
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Trintech Announces Latest Release of CadencyDirect to Drive Greater Efficiency and Control across the Financial Close Process for ServiceNow Customers ACN Newswire

Trintech Announces Latest Release of CadencyDirect to Drive Greater Efficiency and Control across the Financial Close Process for ServiceNow Customers

DALLAS, TX, Aug 16, 2022 - (ACN Newswire via SEAPRWire.com) - Trintech, a leading provider of cloud-based financial close solutions for the Office of Finance, today announced the latest release of CadencyDirect which extends digital workflows for the Office of Finance with new bi-directional workflows for close tasks, enhanced Journal Entry management capabilities, and a greater user experience."With this release, we are helping F&A teams continue to achieve enhanced visibility and control of critical financial data in order to handle risk with confidence," said Michael Ross, Chief Product Officer of Trintech. "With these new bi-directional workflows, ServiceNow customers are positioned to reduce complexity and risk, accelerate the overall process, and drive a greater experience for their teams."Key capabilities of this release include:- Bi-Directional Workflows: Users can individually or bulk close or reopen tasks within the ServiceNow(R) Application- Enhanced Journal Entry Dashboard: Users can now filter and view all Journal Entry detail components- Enhanced User Experience: Users can now access the CadencyDirect platform in a one-click, SSO-enabled user experience"We are continuing to see companies driving digital transformation initiatives, including within the Office of the CFO," said Erica Volini, Senior Vice President, Global Alliances & Partner Ecosystem at ServiceNow. "Instrumental in our partnership with Trintech, CadencyDirect is representative of the technology investments companies must make to drive business transformation. CadencyDirect connects a historically siloed finance team to the broader enterprise for better collaboration, improved employee experience and enhanced operational excellence."CadencyDirect is certified as part of the ServiceNow Built on Now(TM) program that complements and extends financial operations management so that CFOs and their teams can digitize workflows across the financial close process - helping to reduce complexity and risk, accelerating the overall process, and driving a greater experience for the entire enterprise. The platform combines all financial close activities into a single, seamless process, including operational matching, intercompany transaction management, balance sheet reconciliations, journal entry management, close task management and compliance and provides a connected, collaborative ecosystem by leveraging a mature and very robust set of financial controls, along with deep automation and integration capabilities that seamlessly connects with leading ERPs such as SAP(R), Oracle(R), and NetSuite(R).Whether you're an experienced ServiceNow user looking to synchronize your mature or in-progress digital transformation, or just starting your transformation journey, CadencyDirect is where Financial Transformation meets Digital Transformation. For more information, please contact either your appropriate ServiceNow or Trintech representative or go to www.trintech.com/CadencyDirect for more information.About TrintechTrintech Inc., a pioneer of Financial Corporate Performance Management (FCPM) software, combines unmatched technical and financial expertise to create innovative, cloud-based software solutions that deliver world-class financial operations and insights. From high volume transaction matching and streamlining daily operational reconciliations, to automating and managing balance sheet reconciliations, intercompany accounting, journal entries, disclosure reporting and bank fee analysis, to governance, risk and compliance - Trintech's portfolio of financial solutions, including Cadency(R) Platform, Adra(R) Suite, and targeted tools, ReconNET(TM), T-Recs(R), and UPCS(R), help manage all aspects of the financial close process. Over 3,500 clients worldwide - including the majority of the Fortune 100 - rely on the company's cloud-based software to continuously improve the efficiency, reliability, and strategic insights of their financial operations.Headquartered in Dallas, Texas, Trintech has offices located across the United States, United Kingdom, Australia, Singapore, France, Germany, Ireland, the Netherlands and the Nordics, as well as strategic partners in South Africa, Latin America and the Asia Pacific. To learn more about Trintech, visit www.trintech.com or connect with us on LinkedIn, Facebook and Twitter.ServiceNow, the ServiceNow logo, Now, Now Platform, and other ServiceNow marks are trademarks and/or registered trademarks of ServiceNow, Inc. in the United States and/or other countries.Media Contact:Kelli ShoevlinSr. Manager, Global Corporate Marketing & Communicationskelli.shoevlin@trintech.comSOURCE: Trintech, Inc. Copyright 2022 ACN Newswire. All rights reserved. (via SEAPRWire)
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TANAKA Establishes New Ruthenium Film Deposition Process that Contributes toward Miniaturization and Improved Durability of Semiconductors ACN Newswire

TANAKA Establishes New Ruthenium Film Deposition Process that Contributes toward Miniaturization and Improved Durability of Semiconductors

TOKYO, Jun 23, 2022 - (ACN Newswire via SEAPRWire.com) - TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which operates the TANAKA Precious Metals manufacturing business, announced today that TANAKA has established a two-stage film deposition process using the liquid ruthenium (Ru) precursor "TRuST." TRuST is a precursor that has excellent reactivity with both oxygen and hydrogen and can form high-quality ruthenium films. This process is a two-stage atomic layer deposition (ALD) process that uses hydrogen film formation to create a thin anti-oxidation film and oxygen for the deposition of a high-quality ruthenium film. It eradicates concerns that the substrate will become oxidized and, at the same time, can prevent the drop in ruthenium purity that occurs during hydrogen film deposition.The film deposition process was proposed by Professor Soo-Hyun Kim from the School of Materials Science and Engineering, College of Engineering, Yeungnam University in South Korea. The development and evaluation of the film deposition process were jointly conducted by Professor Kim and TANAKA Kikinzoku Kogyo.This technology is expected to achieve greater miniaturization and improved durability of semiconductors. It can therefore be expected to be used in data centers and smartphones - which require even greater data processing capabilities - and contribute toward advanced technologies such as IoT and autonomous driving, which require sophisticated technological innovations.Two-Stage Film Deposition Process Using Oxygen And HydrogenTANAKA Kikinzoku Kogyo is developing high-purity precious metal precursors?centered on ruthenium?for next-generation semiconductors. So far, single-stage film deposition using oxygen has been the mainstream process for film deposition. However, the company has now succeeded in a two-stage film deposition process using oxygen and hydrogen.This two-stage film deposition process reduces the risk of surface oxidation of the base caused by hydrogen film deposition and allows high-purity film deposition that maintains ruthenium purity at almost 100% using oxygen film deposition. Furthermore, by forming the base first using hydrogen film deposition, the ruthenium film on top of the base created using oxygen film deposition will be smooth and dense, achieving a lower resistance than before.Generally, specific resistivity increases when film thickness decreases, which is an issue in film deposition of semiconductors. With this new process, it was confirmed that an even lower resistance results from a two-stage film deposition that uses hydrogen in addition to oxygen film deposition, especially in the range of 10 nm and below. As semiconductors become even smaller in scale in the future, demand for thinner film deposition with low resistance is also expected for ruthenium films, and a two-stage film deposition allows this issue to be resolved. In addition, the new low-resistance, high-purity ruthenium film created by the two-stage film deposition can be achieved using the same raw materials and film deposition temperature for both stages. Therefore, film deposition is possible using the same film deposition equipment, allowing capital investment costs to be suppressed. Details will be announced at the AA2-TuA: ALD for BEOL session of the ALD 2022 conference being held in Ghent, Belgium, on June 28, 2022.TANAKA Kikinzoku Kogyo's Liquid Ruthenium Precursor "TRuST"In the past, the most common thin film and wiring materials used for semiconductors were copper, tungsten, and cobalt, but there are increasing expectations for the precious metal ruthenium to promote greater miniaturization of semiconductors because of its lower resistance and higher durability. Therefore, TANAKA Kikinzoku Kogyo developed TRuST - a liquid ruthenium precursor for chemical vapor deposition (CVD) and ALD that achieved the world's highest vapor pressure value - and started providing samples in 2020.By increasing to the world's highest vapor pressure value, which is more than 100 times higher than existing precursors, this precursor raises the concentration of precursor in the film deposition chamber and the adsorption density of precursor molecules on the substrate surface, achieving excellent step coverage and improved film deposition speed.State of the Semiconductor Industry and BackgroundThe progress of advanced technologies such as IoT, AI, 5G, and the metaverse has led to rapidly increasing volumes of digital data used by digital devices such as smartphones. Therefore, in the development of semiconductors, the need for even greater miniaturization is increasing to enable the creation of devices with higher performance and lower energy consumption. In the aspect of durability, degradation due to base oxidation is also a major issue in semiconductor development. Furthermore, the development of electric vehicles and self-driving cars requires similar needs for the miniaturization of automotive semiconductors along with further improvement in durability.In the semiconductor industry, which will require greater miniaturization and improved durability in the future, TANAKA Kikinzoku Kogyo seeks to further reduce costs and achieve higher quality by improving the film deposition speed of liquid ruthenium precursors. At the same time, the company will contribute to greater miniaturization and improved durability of semiconductors to support the development of new advanced technologies enabled by semiconductors.Press release in PDF: https://www.acnnewswire.com/docs/files/202206_EN.pdfAbout TANAKA Precious MetalsSince its foundation in 1885, TANAKA Precious Metals has built a portfolio of products to support a diversified range of business uses focused on precious metals. TANAKA is a leader in Japan regarding the volumes of precious metals handled. Over the course of many years, TANAKA has not only manufactured and sold precious metal products for industry but also provided precious metals in such forms as jewelry and assets. As precious metals specialists, all Group companies in Japan and around the world collaborate and cooperate on manufacturing, sales, and technology development to offer a range of products and services. With 5,193 employees, the group's consolidated net sales for the fiscal year ending March 31, 2021, was 1,425.6 billion yen.Global industrial business websitehttps://tanaka-preciousmetals.comProduct inquiriesTANAKA Kikinzoku Kogyo K.K.https://tanaka-preciousmetals.com/en/inquiries-on-industrial-products/Press inquiriesTANAKA Holdings Co., Ltd.https://tanaka-preciousmetals.com/en/inquiries-for-media/ Copyright 2022 ACN Newswire. All rights reserved. (via SEAPRWire)
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